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The 1st International Conference on AI Sensors & The 10th International Symposium on Sensor Science

Part of the International Symposium on Sensor Science (I3S) series
1–4 Aug 2024, Singapore, Singapore
Abstract Submission Deadline
3rd April 2024
Abstract Acceptance Notification
3rd May 2024

Early Bird Registration Deadline
3rd June 2024
Covering Author Registration Deadline
14th June 2024
Registration Deadline
1st August 2024

Physical Sensors, Biosensors, Computer Vision, AI Sensors, Sensors Applications, Sensing System, Chemical Sensors, Wearable Sensors, Artificial Intelligence
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AIS-I3S 2024 is Calling for Contributions

The 1st International Conference on AI Sensors and the 10th International Symposium on Sensor Science will be held in University Town, National University of Singapore, Singapore from 1 August to 4 August 2024.
We look forward to your participation!

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Conference Chairs

Prof. Chengkuo Lee received his Ph.D. degree in precision engineering from The University of Tokyo, Tokyo, Japan, in 1996. Currently, he is the GlobalFoundries Chair Professor in Engineering and director of the Center for Intelligent Sensors and MEMS at the National University of Singapore, Singapore. He co-founded Asia Pacific Microsystems, Inc. (APM) in 2001, where he was Vice President of R&D from 2001 to 2005. From 2006 to 2009, he was a Senior Member of the Technical Staff at the Institute of Microelectronics (IME), A-STAR, Singapore. His research interests include MEMS, NEMS, nanophotonics, Si Photonics, metamaterials, energy harvesting, wearable sensors, flexible electronics, artificial intelligence of things (AIoT), Internet of Things (IoT), electroceuticals and biomedical applications. He has trained 38+ Ph.D. students graduated from the ECE Dept., NUS. He has co-authored 480+ journal articles and 380+ conference papers. He holds 10 US patents. His Google Scholar citation is more than 30000. According to the data from Scopus till October 1, 2023, Elsevier has analyzed the academic performance of the top 100,000 scientists by c-score and the top 2% scientists in 174 sub-fields globally (a total of more than 200,000 scientists). In this report, prof. Lee is ranked 13936 globally in the total citations (excluding self-citations) among all the scientists, with an h-index of 62 (excluding self-citations). In the sub-field, Nanoscience and Nanotechnology, he ranks 288 globally on the composite indicator score. On the other hand, his D-index (Discipline H-index) ranks 300 among all the electronics and electrical engineering scientists globally, based on the data till December 21, 2022.

Prof. Guangya Zhou received the B.Eng. and Ph.D. degrees in optical engineering from Zhejiang University, Hangzhou, China, in 1992 and 1997, respectively. He joined the Department of Mechanical Engineering, National University of Singapore (NUS) in 2005 as an assistant professor. And from 2012, he is a tenured associate professor in the same department. His research covers micro-optics, optical MEMS, micro and nano fabrication, microsensors and microactuators, nano photonics, and novel optical imaging and spectroscopy. He has published over 150 research papers in peer-reviewed international journals and is the main inventor of several patents including the MEMS-driven vibratory grating scanner, MEMS-based miniature zoom lens system with autofocus function, miniature MEMS-based adjustable aperture, and high throughput single-pixel spectrometers. He is an editor of a book “Optical MEMS, Nanophotonics, and Their Applications”. He is an associated editor of the International Journal of Optomechatronics and is on editorial board of Scientific Reports and MDPI Actuators. He is also an international steering committee member and technical programme committee member of several international conferences in the field of optical MEMS as well as micro and nano technology.

Prof. Po-Liang Liu is currently a Professor of Graduate Institute of Precision Engineering at National Chung-Hsing University, Taiwan. He obtained his Ph.D. at National Taiwan University of Science and Technology, Taipei, Taiwan. He had conducted postdoctoral research as a Postdoctoral Research Fellow at Arizona State University since July 2004. He joined the faculty of National Chung-Hsing University as an Assistant Professor in 2006. He was invited to serve as the Conference Chairs, Keynote Speakers, or Session Chairs in International Conference on Applied Physics and Mathematics (ICAPM) in 2014 - 2023. He also hosted the International Symposium on Precision Engineering from 2020 to 2023. He was also a Visiting Associate Professor in the Department of Physics of the Norwegian University of Science and Technology, Trondheim, Norway (Aug. 2014 – Jan. 2015). His current research interests include the first-principles simulation of the structural, electronic and energetic properties of semiconductors, materials genome technologies, gas sensors, deep-ultraviolet photodetectors and semiconductors, topological insulators, and the hydrogen storages.

Advisory committee

Prof. Dr. Michael J. Schoening

Director, Institute of Nano- and Biotechnologies, Aachen University of Applied Sciences, Germany

Dr. Piotr Lesiak

Faculty of Physics, Warsaw University of Technology, Poland

Prof. Dr. Tomasz R. Woliński

Faculty of Physics, Warsaw University of Technology, Poland

Prof. Dr. Peter Hauser

Department of Chemistry, University of Basel, Switzerland

AIS Call for Participants

We are thrilled to welcome you to the AI Sensors 2024 Conference at Singapore, a premier gathering of innovators, researchers, and experts at the forefront of sensors, sensing technology, artificial intelligence for sensing applications and AI-enhanced sensing systems.

The rapid evolution of artificial intelligence (AI) has ushered in an era of unprecedented innovation across various industries. As AI continues to transform our world, the integration of AI sensors is becoming increasingly essential. The AI Sensors 2024 is joint-organized with the 10th International Symposium on Sensor Science (I3S 2024) to provide a dynamic platform that brings together academic leaders, thought leaders, pioneers, engineers, students, and visionaries in the multidisciplinary field of AI Sensors. Our mission is to explore cutting-edge advancements, share groundbreaking research, and foster collaboration that will shape the future of sensing technology across various industries.

The major areas of activity in the application of AI Sensors that are solicited and expected at this conference include but are not limited to:

  • Sensing Systems Enhanced by AI
  • Computer Vision
  • AI Sensors Based on Vision and Voice Data
  • Data Fusion and Processing with Sensor Applications
  • Sensor Modality/Sensing System Enhanced by Multi-Modality Deep Learning
  • Data Mining for Sensor Applications
  • Edge Computing Technologies
  • Neuromorphic Computing
  • Computing in Memory
  • In Sensor Computing
  • MEMS Sensors Enhanced by Edge Computing
  • CMOS MEMS/NEMS and AI Sensors
  • Hardware for Enabling Artificial Intelligence of Things (AIoT) Systems
  • Heterogeneous Integration for AIoT Systems
  • Chiplet and System-in-Package (SiP) for AIoT-on-Chip
  • Autonomous AIoT Systems
  • Cutting-Edge AI Sensor Technologies
  • Generative AI Technologies
  • Photonics AI Accelerator
  • Innovative AI Sensor Applications Across Industries

Together with I3S 2024, AI Sensors 2024 will attract more than 600 participants, and provide ample opportunity for interaction between attendees, presenters, and exhibitors.

AIS Symposia

In AI Sensors 2024, we will organize Five Symposia to be a platform to provide the overview and panel discussion forum for cutting-edge AI sensor technologies and enabling technology for AI sensing systems.

  • Symposium 1: Wearable AI Sensors
  • Symposium 2: Energy Harvesting Technology for Self-Sustained AIoT System
  • Symposium 3: Enabling Technologies for Neuromorphic Computing and Photonics Neural Network
  • Symposium 4: Haptic Technology for Future Metaverse Applications
  • Symposium 5. Advances in Intelligent Sensors and Robots for AI-Enhanced Applications - Industry 5.0, Digital Twin, Smart Home, Healthcare, and Rehabilitation

Upon submission, you can select if you wish to be considered for oral presentation or poster presentation. Following assessment by the Chairs, you will be notified in a separate email whether your contribution has been accepted for oral or poster presentation.

I3S Call for Participants

With the finding and artificial synthesis of new recognition elements, the significant advancement in the synthesis of nanomaterials and understanding of their properties, and the innovation of signal transduction principles, sensor science has become one of the most active research areas. The emerging new sensing materials include the low-dimension materials, nanowires, MXene, and MOF, etc. The novel metamaterials also provide a new sensing platform covering a wide wavelength range as well as diversified frequency bands. The AI-enabled metamaterials/metasurface design gives a pathway to generate new physics of sensors and creative systems for sensing applications. In addition to the AI-enabled sensor design, the deep learning enhanced sensory information analysis and data sensor data analytics become indispensable in many applications from industry 4.0, smart traffic control, energy industry, environmental monitoring, smart buildings/factories/hospitals, and smart homes, etc. Hence, we provide a platform to invite academic leaders, thought leaders, pioneers, engineers, students and visionaries from sensors and AI communities to share their cutting-edge technologies in the emerging fields, by joint-organized with AI Sensors 2024. The I3S Conference series has evolved into a premier annual event in the Sensors community. In recent years it has attracted over 400 participants and has presented more than 200 select papers in non-overlapping oral and poster sessions. Together with AI Sensors 2024, the I3S 2024 expects to host 600+ participants worldwide.

This conference will provide leading scientists working in this field with a platform to share their latest research and engage in exciting discussions.

The main topics of the conference include but are not limited to:

  • Physical Sensors and MEMS
  • Chemical Sensors
  • Medical Sensors
  • Gas Sensors
  • Ultrasound Sensors
  • Optical Sensors, CMOS Image Sensors, and IR Focal Plane Array
  • Magnetic Sensors and Spintronics
  • Biosensors and Bioelectronics
  • Wearable Sensors
  • Implantable Sensors, Neural Interfaces and Electroceuticals
  • Sensors for Intelligent Robots
  • Sensors for Drones
  • Self-powered Sensors
  • Zero-biased Sensors and Science
  • Nanomaterials, Nanosensors and NEMS
  • Si Photonics (SiPh) for Sensing
  • Nanophotonics and metalenses for Sensing
  • Metasurface and Mid-IR Sensing
  • Metamaterials and THz Sensing
  • Spectroscopy and Sensing Technology
  • Internet of Things (IoT) and Sensor Networks
  • Energy Harvesting for IoT Sensors
  • Remote Sensors, Data Acquisition and Processing
  • Integration of Actuators with Sensors for Smart Systems

The symposium invites submissions for abstracts that will be reviewed by the conference committee. The authors of accepted contributions will be invited to submit a conference paper along with a slide or poster presentation of their works. All participants will have the opportunity to examine, explore, and critically engage with research during the I3S 2024 and AI Sensors 2024.

I3S Workshops

There will also be Fourteen Workshops with specialized topics in I3S 2024:

  • Workshop 1: Sensors Enhanced by Deep Learning
  • Workshop 2: Sensors Using Metamaterials and Nanophotonics
  • Workshop 3: Sensors and IC Sensors Using CMOS MEMS and CMOS Compatible Materials
  • Workshop 4: Si Photonics for Sensing and Edge Computing
  • Workshop 5: Advanced Semiconductors and Heterogenerous Integration for Sensing Systems and Applications in 6G (e.g., compound semiconductors, 2D materials, chiplet, and system-in-package, etc.)
  • Workshop 6: Sensors, Implanted Energy Harvesters and Devices, and In-body IoT Technology for Prosthesis and Electroceuticals
  • Workshop 7: Sensors for Farming, Agriculture, and Aquaculture Applications
  • Workshop 8: Biosensors and Chemosensors
    Chaired by Prof. Huangxian Ju, Nanjing University, China
  • Workshop 9: Flexible, Stretchable and Wearable Sensors
  • Workshop 10: Self-Powered Sensors and Sensing Systems
  • Workshop 11: IoT Sensors and System Integration
  • Workshop 12: Advances in Sensor Applications
  • Workshop 13: Sensors and Sensor Fusion in Autonomous Vehicles and Drones
  • Workshop 14: Sensors and Sensing Systems for Advanced Metrology

Upon submission, you can select if you wish to be considered for oral presentation or poster presentation. Following assessment by the Chairs, you will be notified in a separate email whether your contribution has been accepted for oral or poster presentation.

Workshop Chairs

Prof. Dr. Huangxian Ju

State Key Laboratory of Analytical Chemistry for Life Science, Department of Chemistry, Nanjing University, China

Huangxian Ju is Director of the State Key Laboratory of Analytical Chemistry for Life Science, member of the International Electrochemical Society and member of the Royal Society of Chemistry. He was appointed a professor at Nanjing University in 1999. In 2003, he was awarded the China Science Foundation for Distinguished Young Scholars. In 2007, he was awarded the "Changjiang Scholars" Distinguished Professor by the Ministry of Education of China. His research interests focus on immunosensors, electrochemical sensors, chemically modified electrodes and biosensors.

Instructions for Authors

To present your research at the event
  • Create an account on Sciforum if you do not have one, then click on Submit Abstract at the top of the Conference website OR click on New Submission in the upper-right corner of the window.
  • Indicate which thematic area is best suited for your research.
  • Submit a 250-word abstract in English - the word limits are a minimum of 200 words and a maximum of 300 words.
  • The deadline to submit your abstract is 3rd April 2024. You will be notified by 3rd May 2024 regarding the the acceptance for poster presentation.
  • Upon submission, you can select if you wish to be considered for oral presentation or poster presentation. Following assessment by the Chairs, you will be notified in a separate email whether your contribution has been accepted for oral or poster presentation.
  • Please note that to finalize the scientific program in due time, at least one registration by any of the authors, denoted as Covering Author, is required to cover the presentation and publication of any accepted abstract.
  • All abstracts accepted for presentation will be collected in a book of abstracts, which will be displayed on the website during the conference.
Poster information

Maximum poster size limited to 80 cm x 140 cm, vertical orientation preferred. Please print your poster prior to the conference.
A plan of the poster session will be circulated later on.

You can use our free template to create your poster. The poster template can be downloaded here.

Publication opportunities
  • Sensors Journal Publication

    Participants in this conference are cordially invited to contribute a full manuscript to the Special Issue, published in Sensors Journal (ISSN: 1424-8220, IF:3.9), with a 20% discount on the publication fee. Please note that no other discounts are applicable. All submitted papers will undergo MDPI’s standard peer-review procedure. The abstracts should be cited and noted on the first page of the paper.

  • Proceeding Paper Publication

    You are welcome to submit a proceeding paper (4-8 pages) to Engineering Proceedings journal (Indexed in Scopus, ISSN: 2673-4591 ) after the conference. Publication of the proceedings will be free of charge.

    Authors are asked to disclose that it is a proceeding paper of the AIS-I3S 2024 conference paper in their cover letter. Carefully read the rules outlined in the 'Instructions for Authors' on the journal’s website and ensure that your submission adheres to these guidelines.

    Proceedings paper submission deadline: 20th September 2024.

    Manuscripts for the proceedings issue must be formatted as follows:
    - Title.
    - Full author names.
    - Affiliations (including full postal address) and authors' e-mail addresses.
    - Abstract.
    - Keywords.
    - Introduction.
    - Methods.
    - Results and Discussion.
    - Conclusions.
    - Acknowledgements.
    - References.


The registration fee includes attendance of all conference sessions, morning / afternoon coffee breaks and lunches, participation in the conference banquet, conference bag. Participation to the conference is considered final only once the registration fees have been paid.

Please note that, in order to finalize the scientific program in due time, at least one registration by anyone of the authors, denoted as Covering Author, is required to cover the presentation and publication of any accepted abstract. Covering Author registration deadline is 14 June 2024.

Please note that abstract submission and conference registration are two separate processes. During registration, please provide us with the same email address you used to submit your abstract(s). Otherwise, leave us a comment in the registration form, providing the email address used during the submission process. In addition, we prefer you to use your institutional email address for both processes.

If you are registering several people under the same registration order, please do not use the same email address for each person, but their individual institutional email addresses. Thank you for your understanding.

Contact [email protected] for all issues related to the registration.

Certificate of Attendance: Participants of the event will be able to download an electronic Certificate of Attendance by accessing their dashboards on once the event is concluded. The certificates will be found under "My Certificates" category.

*Tax is included in the price.

Early Bird
Until 3rd June 2024
Until 1st August 2024
Supported documents
Academic 800.00 SGD 1000.00 SGD
Invited speaker 750.00 SGD 950.00 SGD
Student 600.00 SGD 800.00 SGD Scanned copy or photograph of your current student ID card.
Non-academic 900.00 SGD 1100.00 SGD
Active discounts

Group of 3: 5% discount

Note: Group size refers to the number of registered attendees in the same registration order.

Cancellation policy

Participation to the conference is considered final only once the registration fees have been paid. The number of participants is limited, once the number of paid registrations reaches the maximum number of participants, unpaid registrations will be cancelled.

Cancellation of paid registration is possible under the terms listed below:
> 1 month before the conference Full refund but 200 SGD are retained for administration
> 3 weeks before the conference Refund 50% of the applying fees
> 2 weeks before the conference Refund 25% of the applying fees
< 2 weeks before the conference No refund

In the unlikely event that AIS-I3S 2024 Conference Secretariat shall deem it necessary to cancel the conference, all pre-paid registration fees will be reimbursed. AIS-I3S 2024 Conference Secretariat shall not be liable for reimbursing the cost of travel or accommodation arrangements made by individual delegates.

Photographs and/or video will be taken during the conference
By taking part in this event you grant the event organisers full rights to use the images resulting from the photography/video filming, and any reproductions or adaptations of the images for fundraising, publicity or other purposes to help achieve the conference’s aims. This might include (but is not limited to), the right to use them in their printed and online publicity, social media, press releases and funding applications.

Payment methods

Wire transfer, Credit card

Currencies accepted by this event

Swiss francs (CHF) ,  Euros (EUR) ,  US dollars (USD) ,  Pounds sterling (GBP) ,  Japanese yen (JPY) ,  Canadian dollars (CAD) and Singapore dollars (SGD)

Conference Secretariat

Ms.Judith Wu
Ms. Alethea Liu
Ms. Joyce Yang
[email protected]

Sponsors and Partners


Media Partners